Robatech SpeedStar Compact hot-melt adhesive application head

The SpeedStar Compact hot-melt adhesive application head from Robatech has small installation dimensions and provides speed and high precision over its service life. It has all the features that provide added value to the packaging, converting and graphic industry.

The jetting head SpeedStar Compact is one of the fastest and most compact application heads available for high-precision hot melt adhesive applications.

With up to 800 switching cycles/s, it enables very small bead and dot application for particularly demanding and clean gluing applications at high production speeds.

Robatech integrated an automatic stroke adjustment to ensure that the electromechanical jetting head can maintain the precision in adhesive application over the entire service life of approx. 500 million operating cycles. Manual readjustments are no longer necessary, and maintenance-related interruptions are reduced.

Compared to its predecessor SpeedStar Diamond, the new electric head has been technically optimised in terms of hardware and is, therefore, more durable. As the electronic unit is detached from the head, SpeedStar Compact is also 46 mm smaller.

Space-saving integration into systems and entire machines becomes possible for the users. The higher protection class IP55 allows better use in wet areas.

SpeedStar Compact is now available as a single- and multi-head in a short or long version.