Herrmann Ultrasonics with Top Seal Module for pouch packaging

Suitable for the pouch packaging industry, Herrmann Ultrasonics with the Top Seal Module (TSM) solution is designed to eliminate the need for separate heating and cooling stations while ensuring 100% leak-proof packaging.

The advanced ultrasonic sealing technology integrates smart detection capabilities, instantly rejecting faulty packages to help minimise downtime and reduce costs. By generating thermal energy only within the seam area using controlled vibrations, the solution can eliminate the need for preheating, creating an airtight seal with a good appearance.

Key benefits include: claimed to have 20x fewer rejects and up to 75% energy savings; waste reduction with leak-proof packaging preventing food waste; hermetic and cosmetic seals create tight seals in just one station; sustainability improved with savings on materials and bond; contamination tolerance, can achieve tight seals even with seal contamination; enhanced durability, easy cleaning with IP65/67 protection for good hygiene; and simplified quality control.

The TSM is suitable for sealing mono-materials, addressing the growing demand for sustainable packaging. Instead of applying external heat, ultrasonics generate heat for a short time through mechanical vibrations within the material. This gentle process is designed to ensure the seal is not only 100% tight but also visually appealing.