Submissions open for 2013 APPMA scholarship program

Submissions are now open for the fifth annual APPMA (Australian Packaging and Processing Machinery Association) scholarship program, which gives a packaging engineer the opportunity to complete a Diploma in Packaging Technology.

“The Diploma in Packaging Technology is a Level 5 qualification which is internationally recognised for those wishing to pursue a career in the packaging industry or for those who are already in the industry and who wish to extend their knowledge and expertise,” said APPMA Chair Mark Dingley.

“It has been offered by the AIP [Australian Institute of Packaging] continuously since 1980 and has an exemplary record of successful students.

“The Diploma prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.”

APPMA and the AIP are targeting two groups for the scholarship:

1. People currently employed in parts of the packaging industry who want to broaden their knowledge and understanding and take on greater levels of responsibility.
2. People who are currently employed in the industry, who may be following courses in associate subject areas such as packaging design, food science/technology, materials science/engineering and logistics. The Diploma in Packaging Technology will broaden the scope of these studies.

Ralph Moyle, National President of the AIP, encourages all packaging engineers to apply for the 2013 scholarship.

Submissions must be received by close of business on Friday 22 March. The recipient of the scholarship will be announced on 8 May during the 2013 APPMA Awards of Excellence, held during AUSPACK PLUS 2013. For more information about the scholarship, visit www.appma.com.au.