UTS student wins AIP scholarship

Tuesday, 20 November, 2012


A University of Technology Sydney (UTS) student has been announced as the winner of the Australian Institute of Packaging (AIP) Scholarship. Nancy Malik was a finalist in the 2012 Cormack Innovation Awards and was awarded the AIP scholarship.

“It is wonderful to be at the front line of innovation in packaging and the AIP Scholarship is a great opportunity for me,” Malik said.

“I have always had a passion for plastics and for common type products and fulfilling the needs of everyday people. FMCG is an area I would like to be involved in.

Winner Nancy Malik with William Woo.

Winner Nancy Malik with William Woo.

“I have been interested in packaging and really enjoyed an internship I completed at a consultancy firm working on packaging and seeing how things evolve in a 3D form and how packaging affects the way that someone uses a product.”

Now in its 11th year, the Cormack Innovation Awards are open to third-year industrial design students. The awards are judged by senior industry representatives working in FMCG, beverage, chemical cleaning and pharmaceutical companies. The scholarship helps the winning student continue their studies in the specialised field of packaging development.

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