First-ever joint winners announced for AIP scholarship
For the first time in five years, the Australian Institute of Packaging (AIP) scholarship has been awarded to two winners. The scholarship is traditionally awarded to one finalist in the Cormack Innovation Awards; however, this year it was awarded to two: University of Technology, Sydney students James Bossi and Justin Chong.
“Both candidates were excellent samples of the quality of students undertaking design courses in Australia,” said Ralph Moyle, National President of the AIP.
“James Bossi demonstrated good methodology and thinking throughout the scholarship process. He displayed a clear interest and involvement in the packaging industry. He understood the importance of recycling and sustainability within packaging design development and has a real interest in solving some of the packaging problems the industry has currently been experiencing.
“Justin Chong is already doing Point of Sale construction and design and his mechanical skills were part of his in-depth answers. He provided compelling answers to all questions and he was well spoken and articulate.
“The judges would hope that other schools throughout Australia would allow their students to participate and take advantage of opportunities like the Cormack Innovation Awards. The AIP would like to take this opportunity to congratulate James Bossi and Justin Chong for being such exceptional candidates and the institute looks forward to seeing both of these students become outstanding packaging technologists.”
The Cormack Innovation Award scholarship complements other programs inititiatedby the AIP including the APPMA (Australian Processing and Packaging Machinery Association) scholarship for the Diploma in Packaging Technology and the AIP scholarship for the PCA Southern Cross Awards.
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