Apply now for the APPMA 2013 Scholarship

Australian Institute of Packaging
Wednesday, 28 November, 2012

Submissions are now being accepted for the APPMA (Australian Packaging and Processing Machinery Association) 2013 Scholarship. The fifth annual scholarship program, announced by APPMA in conjunction with the Australian Institute of Packaging (AIP), gives a packaging engineer the opportunity to complete a Diploma in Packaging Technology.

APPMA and the AIP are encouraging applications from the following groups:

  1. People currently employed in parts of the packaging industry who want to broaden their knowledge and understanding and take on greater levels of responsibility.
  2. People who are currently employed in the industry, who may be following courses in associate subject areas such as packaging design, food science/technology, materials science/engineering and logistics.

The Diploma in Packaging Technology has been designed so the intended learning outcomes, which reflect the requirements of industry, clarify the course objectives.

“The Diploma in Packaging Technology is a Level 5 qualification which is internationally recognised for those wishing to pursue a career in the packaging industry or for those who are already in the industry and who wish to extend their knowledge and expertise,” said Mark Dingley, Chairman of APPMA. “It has been offered by the AIP continuously since 1980 and has an exemplary record of successful students.

“The diploma prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.”

Anna Roland, winner of the APPMA 2012 Scholarship, with Mark Dingley.

Anna Roland, winner of the APPMA 2012 Scholarship, with Mark Dingley.

Ralph Moyle, MAIP, National President of the AIP, said the AIP is grateful that associations like APPMA recognise the importance of education and training and are contributing to the growth of the packaging industry as a whole in Australia.

“The APPMA annual scholarship program is now in its fifth year and the AIP encourages all packaging engineers to register for the 2013 scholarship,” Moyle said.

Application forms for the APPMA 2013 Scholarship program can be requested by emailing or Application forms are also available on the APPMA and AIP websites.

Submissions must be received by close of business on Friday 22 March 2013. The winner will be announced at the 2013 APPMA Awards of Excellence, which are held during AUSPACK PLUS 2013.

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