Bemis and Thinfilm partner to create flexible sensing platform
Thin Film Electronics and Bemis have announced an agreement to develop a new category of packaging that can collect and wirelessly communicate sensor information. The companies anticipate the flexible sensing platform will be used by food, consumer products and healthcare companies.
Under the agreement, Thinfilm will create a customisable sensor platform that Bemis will tailor to customers’ requirements. The platform will be adaptable for monitoring and recording key physical properties and environmental data in packaged perishable products.
“These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered,” said Davor Sutija, CEO of Thinfilm.
“Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to everyday lives of millions of people worldwide.”
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