Active and Intelligent Packaging World Congress Amsterdam 2019

18 November, 2019 - 19 November, 2019


This two-day event will explore how new packaging technologies can provide opportunities in data mining, shelf life improvement, consumer engagement, brand authentication and recycling.

Attendees can hear talks on: ‘Nestlé’s Smart Packaging project’; wireless sensors that detect tropical fruits’ ripeness; Kraft Heinz’s use of NFC tags in Walmart stores; nanotechnology in packaging; augmented reality (AR) opportunities in smart packaging; ‘The Role of Blockchain in your Smart Packaging Ecosystem’; using intelligent packaging to achieve ‘zero waste’ and ‘How Artificial Intelligence can eliminate product recalls’.

Event Details


Date 18 November, 2019 - 19 November, 2019
Online Click here to visit the event website
Venue Amsterdam Conference Centre
Organiser Active and Intelligent Packaging Industry Association

Event Location


Amsterdam Conference Centre
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