New Zealand annual packaging scholarship program


Wednesday, 22 November, 2017

In conjunction with the Australian Institute of Packaging (AIP), the Packaging Council of New Zealand (PAC.NZ) has announced the launch of an annual scholarship program. Every year, a New Zealand packaging professional such as a technologist, designer or engineer will have the opportunity to complete a Diploma in Packaging Technology worth $9000.

The Level 5 qualification will appeal to anyone wishing to pursue a career in the packaging industry or to existing professionals who wish to expand their knowledge within the industry. It would demonstrate commitment and expertise in the industry and promote the right candidate to a more senior position.

“The Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive and provides an opportunity to study the principles of packaging, packaging materials and packaging processes,” said Harry Burkhardt, president of PAC.NZ.

The diploma is divided into the following four units:

  • Packaging in Today’s World
  • Packaging Materials and Components
  • Packaging Processes
  • Packaging Related Research Project

There is also a list of criteria candidates must meet in order to be considered. They must have a minimum of two years’ experience in the packaging industry; be supported by their company for the three-year course; provide two references of their technical competency; and be a New Zealand citizen or resident.

“The packaging industry is dynamic and diverse, offering career opportunities across a wide scope of disciplines. PAC.NZ has been representing businesses in the packaging industry in New Zealand since 1992 and recognises that investment in the packaging industry starts with investment in its people. We strongly encourage everyone in the industry to apply for this scholarship,” Burkhardt said.

Submissions will close on 23 February 2018 and the winner of the scholarship will be announced at the 2018 Packaging & Processing Innovation & Design Awards (PIDA) on 2 May 2018.

Follow the links to find out more information and to access the entry form.

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